Major semiconductor plants in India 2026: Complete list and locations

India’s semiconductor manufacturing ecosystem is gaining momentum, with several semiconductor fabrication, packaging, assembly and testing projects being established across the country. The approved projects involve major domestic and global companies and are spread across states including Gujarat, Assam, Uttar Pradesh, Odisha, Punjab and Andhra Pradesh.

Details of the approved semiconductor manufacturing projects are as follows:

1. Micron Technology Inc. is establishing a semiconductor manufacturing facility in Gujarat with an investment of Rs. 22,516 crore. Micron’s facility in India will undertake assembly and testing of both DRAM and NAND products to cater to demand from domestic and international markets. The facility will have a production capacity of around 14 million units per week.
   
2. Tata Electronics Private Limited (TEPL) is establishing a semiconductor manufacturing facility in Gujarat with an investment of Rs. 91,526 crore. The semiconductor fab will be set up in technology partnership with PSMC, Taiwan. The project will have a production capacity of around 50,000 wafer starts per month (WSPM).
   
3. Tata Electronics Private Limited (TEPL) is establishing another semiconductor manufacturing facility in Assam with an investment of Rs. 27,120 crore. The facility will use indigenous semiconductor packaging technologies and will have a production capacity of 48 million units per day.
   
4. CG Power and Industrial Solutions Limited is establishing a semiconductor manufacturing facility in Gujarat with an investment of Rs. 7,584 crore. The facility will be established as a joint venture with Renesas Electronics America Inc., USA, and STARS Microelectronic, Thailand. Technology for the facility will be provided by Renesas Electronics Corporation, Japan, and STARS Microelectronic, Thailand. The facility will have a production capacity of around 15.07 million units per day.
   
5. Kaynes Technology India Limited (KTIL) is establishing a semiconductor manufacturing facility in Gujarat with an investment of Rs. 3,307 crore. The facility will focus on wire bond interconnect and substrate-based packages. Technology will be provided by ISO Technology Sdn. Bhd. and AOI Electronics Co. Ltd. (AOI). The facility will have the capacity to produce more than 6.33 million chips per day.
   
6. Vama Sundari Investments (Delhi) Private Limited (VSIPL) is establishing a semiconductor manufacturing facility in Uttar Pradesh with an investment of Rs. 3,706 crore. The facility will manufacture display driver ICs (DDIC) using Gold (Au) Bump technology, along with chip probing facilities and die processing services. The technology will be provided by Hon Hai, Taiwan. The facility will be established as a joint venture between VSIPL and Foxconn India. The production capacity will be around 20,000 wafers per month, equivalent to 36 million chips per month.
   
7. 3D Glass Solutions Inc. (3DGS) is establishing a semiconductor manufacturing facility in Odisha with an investment of Rs. 1,943 crore. The plant will undertake assembly of packaged products such as Flip Chip Ball Grid Array (FCBGA), Radio Frequency System in Package (RF SiP), Antenna in Package System in Package (AiPSiP), glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration (3DHI) modules. The proposed installed capacity for glass panel substrate production, assembly and 3DHI will be around 5,800 panels per month, 4.20 million units per month and 1,100 units per month, respectively.
   
8. SiCSem Private Limited is establishing a semiconductor manufacturing facility in Odisha with an investment of Rs. 2,066 crore. The facility will be developed in technology partnership with Clas-SiC Wafer Fab Ltd. for the SiC fab and Continental Device India Pvt. Ltd. for packaging. The facility will have a production capacity of 5,000 wafers per month and a packaging capacity of 8 million units per month.
   
9. Continental Device India Private Limited (CDIL) is expanding its semiconductor manufacturing facility in Punjab with an investment of Rs. 117 crore. The facility will manufacture high-power discrete semiconductor devices, including MOSFETs, IGBTs, Schottky bypass diodes and transistors, using both Silicon and Silicon Carbide. The production capacity will be around 158.38 million units per annum.
   
10. Advanced System in Package Technologies Private Limited (ASIP) is establishing a semiconductor manufacturing facility in Andhra Pradesh with an investment of Rs. 480 crore. The facility will be developed in technology partnership with APACT Co. Ltd., South Korea. The production capacity of the facility will be around 96 million units per annum.